Assemble microelectromechanical systems

Description

Build microelectromechanical systems (MEMS) using microscopes, tweezers, or pick-and-place robots. Slice substrates from single wafers and bond components onto the wafer surface through soldering and bonding techniques, such as eutectic soldering and silicon fusion bonding (SFB). Bond the wires through special wire bonding techniques such as thermocompression bonding, and hermetically seal the system or device through mechanical sealing techniques or micro shells. Seal and encapsulate the MEMS in vacuum.

Occupations requiring this skill

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Skill demand overview
  • Essential in 0 occupations
  • Optional in 1 occupations
  • Total: 1 occupations
  • Most common in: ISCO major group 2 (Professionals)

Optional for

  • Microsystem engineer
    Microsystem engineers research, design, develop, and supervise the production of microelectromechanical systems (MEMS), which can be integrated in mechanical, optical, acoustic, an…

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Last updated on February 18, 2026

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