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Career Guidance Skills handling and moving S6.5 - assembling and fabricating products S6.5.3 - assembling electrical and electronic products Assemble microelectromechanical systems
Description
Build microelectromechanical systems (MEMS) using microscopes, tweezers, or pick-and-place robots. Slice substrates from single wafers and bond components onto the wafer surface through soldering and bonding techniques, such as eutectic soldering and silicon fusion bonding (SFB). Bond the wires through special wire bonding techniques such as thermocompression bonding, and hermetically seal the system or device through mechanical sealing techniques or micro shells. Seal and encapsulate the MEMS in vacuum.
Occupations requiring this skill
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Skill demand overview
- Essential in 0 occupations
- Optional in 1 occupations
- Total: 1 occupations
- Most common in: ISCO major group 2 (Professionals)
Optional for
- Microsystem engineerMicrosystem engineers research, design, develop, and supervise the production of microelectromechanical systems (MEMS), which can be integrated in mechanical, optical, acoustic, an…
Related skills
- Microelectromechanical systems
- Adjust engineering designs
- Create technical plans
- Perform resource planning
- Manage personal professional development
- Nanotechnology
- Prepare production prototypes
- Biomedical engineering
- Mathematics
- MOEM
- Develop product design
- Develop microelectromechanical system test procedures
- Use precision tools
Last updated on February 18, 2026
