Slice crystals into wafers

Description

Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.

Occupations requiring this skill

This section is generated automatically.

Skill demand overview
  • Essential in 1 occupations
  • Optional in 0 occupations
  • Total: 1 occupations
  • Most common in: ISCO major group 8 (Plant and machine operators, and assemblers)

Essential for

  • Semiconductor processor
    Semiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC's). They may also repair, test, and r…

Related skills

 
Last updated on February 18, 2026

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