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Career Guidance Skills working with machinery and specialised equipment S8.5 - operating machinery for the manufacture of products S8.5.8 - operating cutting, grinding and smoothing machinery Slice crystals into wafers
Description
Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.
Occupations requiring this skill
This section is generated automatically.
Skill demand overview
- Essential in 1 occupations
- Optional in 0 occupations
- Total: 1 occupations
- Most common in: ISCO major group 8 (Plant and machine operators, and assemblers)
Essential for
- Semiconductor processorSemiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC's). They may also repair, test, and r…
Related skills
- Imprint circuit design onto wafers
- Adjust manufacturing equipment
- Report defective manufacturing materials
- Integrated circuit types
- Integrated circuits
- Repair electronic components
- Load electronic circuits onto wafers
- Waste removal regulations
- Read assembly drawings
- Semiconductors
- Replace defect components
- Remove defective products
