Slice crystals into wafers

Description

Operate wire saw machines to slice the silicon crystals into ultra thin wafers of approximately 2/3 millimeters thick.

Alternative labels

crystal slicing to make wafers
operating wire saw machines
wire saw machine operating
slicing crystals into wafers
operate wire saw machines
wire saw machines operating

Skill type

skill/competence

Skill reusability level

occupation-specific

Relationships with occupations

Essential skill

Slice crystals into wafers is an essential skill of the following occupations:

Semiconductor processor: Semiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC’s). They may also repair, test, and review the products. Semiconductor processors work in cleanrooms and therefore need to wear a special lightweight outfit that fits over their clothing to prevent particles from contaminating their worksite.

Optional skill

Slice crystals into wafers is optional for these occupations. This means knowing this skill may be an asset for career advancement if you are in one of these occupations.

 


 

References

  1. Slice crystals into wafers – ESCO

 

Last updated on September 20, 2022