Polish wafers

Operate robotic machines to clean, buff, and polish the wafers using a process called lapping. The result is wafers of silicon with a surface roughness of less than one millionth of a millimeter.

This section is generated automatically.

• Imprint circuit design onto wafers
• Adjust manufacturing equipment
• Produce semiconductor crystals
• Integrated circuit types
• Integrated circuits
• Repair electronic components
• Report defective manufacturing materials
• Waste removal regulations
• Read assembly drawings
• Load electronic circuits onto wafers
• Replace defect components
• Remove defective products