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Career Guidance Skills handling and moving S6.7 - using hand tools S6.7.3 - smoothing surfaces of objects or equipment Polish wafers
Description
Operate robotic machines to clean, buff, and polish the wafers using a process called lapping. The result is wafers of silicon with a surface roughness of less than one millionth of a millimeter.
Occupations requiring this skill
This section is generated automatically.
Skill demand overview
- Essential in 1 occupations
- Optional in 0 occupations
- Total: 1 occupations
- Most common in: ISCO major group 8 (Plant and machine operators, and assemblers)
Essential for
- Semiconductor processorSemiconductor processors manufacture electronic semiconductors as well as semiconductor devices, such as microchips or integrated circuits (IC's). They may also repair, test, and r…
Related skills
- Meet deadlines
- Oversee logistics of finished products
- Inspect semiconductor components
- Operate precision machinery
- Electronics
- Dispose of hazardous waste
- Monitor machine operations
- Apply health and safety standards
- Microassembly
- Ensure public safety and security
- Imprint circuit design onto wafers
- Adjust manufacturing equipment
